Professor of the Graduate School of Materials Science and Engineering
484 Hearst Memorial Mining Building
Berkeley, CA 94720-1760
Phone: (510) 642-3815
Research Website: www.mse.berkeley.edu/groups/morris/index.html
Gum Metal and the Limits of Strength
Lead-Free Solder for Microelectronics
In this project, we investigate the reliability, microstructure and mechanical properties of environmentally friendly Pb-free solders. Current research uses a custom built apparatus for mechanical testing of solder joints under current, at elevated temperatures, or a combination of conditions. A wide array of sample types are tested, from idealized simple shear specimens to complete microelectronic packages, to better understand the complex interactions that occur in these interconnects.
Other, past research in this area has included solder substrate reactions and wetting characteristics, microstructure forms and stability, and methods of accelerated testing to ensure reliability in service. Future projects building on this body of research are under development.